Quantify Physical Behaviors of Electronic
Products With The TA.XTPlus Texture Analyzer

Testing many electronic industry products such solder paste, silicone gels and a wide variety of adhesives and films has never been easier.   Now with the TA.XT2i/High Resolution Texture Analyzer and the TA.XTPlusTexture Analyzer you can measure the physical characteristics of virtually any product.

 You no longer need to rely on crude firmness tests, non-reproduciable tack tests, archaic Instron-style tests, or other tests which provide only single parameters about your products. 

If you are designing specific performance characteristics into your products - your test should measure that performance.  Old standard test methods have yet to catch up to current performance requirements.

The TA.XT2's ease of use, flexibility, accuracy and repeatability is making it an extremely popular method for quantifying your products.  Ask us about our references in the gel, electronics, and adhesive industry, and for our brochures, application studies, and article reprints from Adhesive & Sealants IndustryAdhesive Age magazines.

Electronic Industry Products Which Can be Tested
Potting Gels
Wafer Dicing Tapes
Wafer Films
Silicone Gels
Underfil Epoxies
Lubricants
Glues
Labels
Epoxies
Pressure Sensitive Adhesives & Tapes
Connectors
Waxes
Sealants
Chip - Die Break & Fracturability
Solder Paste
Solder Paste Tack Testing Solder Paste Tack Testing 90 Degree Peel of Electronic Industry Products

Silicone Gels & Other Gels

Quantify:
Gel Firmness
Gel Relaxation
Gel Adhesion 
Gel Adhesion vs Cohesion
Gel Extensibility
Tack
Cure Behaviors & Cure Tack Time
Resilience
Quantify These Adhesive Behaviors:
Adhesiveness
Quick Stick
Tackiness
Green Strength & Cure Behaviors
Cohesiveness
Shear Strength & Creep
Stringiness & 'legs'
Extensibility
Film & Tensile Strength
180 degree Peel strength 
90 degree Peel strength
Floating Peel Strength
A typical tack test will generate a graph such as the one below.  Notice how the results can be interpreted for:

Adhesive Peak Force (1f)

Area of adhesive work (area between anchors 1 and 3)

Stringiness of the product (distance between anchors 1 and 3)

Cohesiveness of the product relative to the adhesiveness to the probe (area 2:3 over area 1:2)

Initial Adhesive strength (gradient 1:4)

 Many other adhesive parameters can be readily calculated from  this and similar plots.

Picture of typical adhesive plot showing available calculations